Lightweight Aluminum Diamond (Al/Diamond) Heat Sinks
UKing Diamond’s factory-direct Al/Diamond metal matrix composites (MMC) combine isotropic thermal conductivity of 400–950 W/m·K with ultra-low density, providing an ideal lightweight thermal management solution for aerospace electronics, defense systems, GaN power devices, and advanced semiconductor packaging.
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Description
Uking Diamond’s Aluminum Diamond (Al/Diamond) materials represent the pinnacle of lightweight thermal engineering. By high-pressure infiltrating molten aluminum alloy into a dense synthetic diamond skeleton, we produce customized components that exhibit high structural stability and excellent machine ability:
- Aerospace & Satellite Electronics: Delivers mission-critical cooling for payload transponders and radar systems where every gram of weight reduction drastically lowers launch costs.
- 5G/6G Macro Base Stations: Serves as high-efficiency thermal spreaders for remote radio heads (RRH) and MIMO antenna arrays, enduring harsh outdoor environmental swings.
- Automotive Power Inverters: Protects IGBT and SiC power modules in electric vehicle drive trains from high-temperature failures under aggressive acceleration cycles.
- High-Speed Optoelectronics & Transceivers: Provides laser-flat, low-expansion mounting sub mounts for 400G/800G optical communication chips.
Technical Specifications
| Physical & Engineering Property | Technical Specification Standard |
| Material Matrix Architecture | Premium Aluminum/Alloy Matrix (Al) + High-Purity Diamond Grids |
| Thermal Conductivity | 400 – 950 W/m⋅K (Exceeds pure copper with 1/3 of the weight) |
| Coefficient of Thermal Expansion | 11.6×10−6 /K to 6.5×10−6 /K (Tailored to match GaN & Si) |
| Material Density | 3.1 – 3.5 g/cm3 (Ultimate weight-saving thermal solution) |
| Flexural Strength | ≥400 MPa (Preserves initial strength up to 500∘C environmental limits) |
| Dimensional Length/Width Tolerance | ±0.05 mm (High-precision near-net shape capability) |
| Thickness Range Limits | 0.5 mm – 1.0 mm (Customizable thinner profiles available) |
| Machining Profile Tolerance | ±30 μm (Ensures perfect alignment in automated pick-and-place lines) |
| Surface Roughness | <2 μm (Optimized for Ni/Au electroplating and advanced soldering) |
Product Details
- The Ultimate Weight-to-Performance Ratio for Aerospace
In advanced aerospace and mobile defense systems, using heavy copper heat sinks is a liability. Uking’s Aluminum Diamond composites change the game.
Boasting a density of just 3.1 – 3.5 g/cm3 (virtually identical to standard aluminum but with a thermal conductivity up to 950 W/m⋅K), these plates allow system architects to maximize continuous RF power output without exceeding the critical payload mass restrictions.
- Thermal Shock Immunity & High Temperature Survival
Electronic systems utilizing GaN or silicon devices often face harsh thermal cycles. Our Al/Diamond plates are engineered to withstand these extreme conditions with superior stability:
-Exceptional Thermal Stability: Maintains over 90% of initial flexural strength even at continuous operating temperatures up to 500°C.
-Superior Internal Integrity: Utilizes precise vacuum pressure metallurgical processing to effectively prevent voids and catalyst pooling (e.g., cobalt) at internal boundaries.
-Tailored CTE Matching: Features an engineered low Coefficient of Thermal Expansion (6.5–11.6 ppm/K) that aligns perfectly with semiconductor die expansion curves. This prevents micro-delamination, solder cracking, and sudden module failure.
Key Features & Value Drivers
Ultra-Lightweight Thermal Defense: Delivers copper-grade thermal throughput at one-third of the weight, maximizing payload efficiency.
Tailored Low Thermal Expansion: Seamlessly scales from 6.5 to 11.6 ppm/K via structural composition tweaks, eliminating mechanical packaging fatigue.
- Extreme Thermal Stability: Retains high structural integrity and rigid strength under 500°C high-stress environments.
- High Complex Shape Adaptation: Easily mass-manufactured into custom complex geometries with counterbores and multi-level steps according to your drawings.
Are your aerospace transponders or high-frequency 5G modules bottlenecked by the extreme weight of copper heat sinks or catastrophic CTE cracking?
Stop compromising your mobile electronics with heavy, outdated thermal spreaders. Backed by 20 years of advanced metal-matrix composite (MMC) synthesis expertise in Henan, China, Uking Diamond delivers ultra-lightweight Aluminum Diamond heat sinks that elevate system reliability.
Because every Al/Diamond plate requires high-purity diamond lattices processed under strict vacuum-pressure infiltration controls, we do not distribute unchecked free samples. We focus entirely on high-intent industrial evaluation.
Ready to cut weight and maximize your ROP? Contact our engineering team today with your target standard specifications (Length, Width, Thickness) and configuration limits. We will instantly open your Corporate Evaluation Pass: obtain your prioritized evaluation trial batch of standard Al/Diamond plates at direct factory wholesale pricing, with 100% of the sample evaluation cost fully credited back to your account upon your first bulk commercial order.
FAQ
Q: What is a Diamond-Aluminum (Al/Diamond) composite and how does it differ from Diamond Copper composite?
A: Diamond-Aluminum (Al/Diamond) composite consists of synthetic diamond particles (40–65 vol%) in an aluminum matrix, typically produced by gas pressure infiltration of diamond preforms with molten aluminum alloy. Compared to Diamond-Copper composite: Al/Diamond has lower thermal conductivity (400–600 W/m·K vs. 600-750 W/m-K for Cu/Diamond) but lower density (3.0-3.5 g/cm3 vs. 5.5-6.0 g/cm3), making it the preferred choice for weight-critical applications in aerospace electronics, satellite power amplifiers, and airborne radar. The CTE of Al/Diamond is 7–10 ppm/°C – similar to Cu/Diamond – providing compatibility with GaAs, GaN, and silicon device substrates. The lower melting point of aluminum also permits lower processing temperatures, reducing residual stress in the sintered composite compared to copper infiltration.
Q: What is the specific thermal conductivity (thermal conductivity divided by density) of Diamond Aluminum composite compared to other thermal management materials?
A: Specific thermal conductivity (W/m-K per g/cm3) is the key figure of merit for weight-critical thermal management:
standard Al/Diamond (60 vol%, 500 W/m-K, 3.2 g/cm3) – specific thermal conductivity ~156 W·m·kg⁻¹;
Cu/Diamond (60 vol%, 650 W/m·K, 5.8 g/cm³) – ~112 W·m·kg⁻¹;
pure copper (390 W/m·K, 8.9 g/cm3) – ~44 W·m·kg⁻¹;
aluminum (237 W/m-K, 2.7 g/cm3) – ~88 W·m·kg⁻¹;
AlSiC (200 W/m-K, 3.0 g/cm3) ~67 W·m·kg⁻¹.
Al/Diamond composite provides the highest specific thermal conductivity of any practical packaging material, making it the optimal choice for aerospace and satellite applications where every gram of system mass carries a launch cost penalty.
Q: What machining and surface finishing processes are used for Diamond-Aluminum composite components?
A: Diamond-Aluminum composite is extremely difficult to machine with conventional tooling because the diamond particles in the matrix wear carbide tools catastrophically. Processing methods:
(1) Diamond grinding – the primary method for surface finishing; vitrified or resin-bond diamond wheels achieve Ra < 0.4 μm on bonding faces.
(2) EDM (electrical discharge machining) – applicable if the composite has sufficient electrical conductivity; more suitable for Cu/Diamond than Al/Diamond due to aluminum’s lower conductivity.
(3) Laser cutting and drilling – for through-holes and contour cutting; requires laser parameters optimized for the composite to avoid Al matrix melting without diamond graphitization.
(4) Near-net-shape casting – most components are cast close to final geometry to minimize machining.
Surface metallization: electroless Ni (3–5 μm) + Au flash (0.1 μm) is the standard finish for soldering. Direct Al bonding to Si substrates using diffusion bonding is also available for hermetic packaging.
